tangara-hw/mainboard/footprints.pretty/WSON-12.kicad_mod
2023-05-31 16:20:03 +10:00

75 lines
5.4 KiB
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(footprint "WSON-12" (version 20221018) (generator pcbnew)
(layer "F.Cu")
(attr through_hole)
(fp_text reference "REF**" (at 0 -3.1) (layer "F.SilkS")
(effects (font (size 1 1) (thickness 0.15)))
(tstamp dbd08a6e-149e-420a-87bc-2aa26de582c8)
)
(fp_text value "WSON-12" (at 0 3.1) (layer "F.Fab")
(effects (font (size 1 1) (thickness 0.15)))
(tstamp f973f251-088a-4118-9cb9-f811351c24ed)
)
(fp_line (start -1.7 1.7) (end -1.7 1.575)
(stroke (width 0.12) (type default)) (layer "F.SilkS") (tstamp f9bfc919-d9ad-46d3-bde4-15a3a5d2b4a4))
(fp_line (start -1.575 -1.7) (end -1.85 -1.7)
(stroke (width 0.12) (type default)) (layer "F.SilkS") (tstamp 938aa9a3-0096-4a15-b93c-863b280bc5fe))
(fp_line (start -1.575 1.7) (end -1.7 1.7)
(stroke (width 0.12) (type default)) (layer "F.SilkS") (tstamp 83946ca1-4fab-4ad5-97fb-9e1f7ee8d226))
(fp_line (start 1.575 -1.7) (end 1.7 -1.7)
(stroke (width 0.12) (type default)) (layer "F.SilkS") (tstamp 754adab5-2f06-4ae4-9266-a2be556917d5))
(fp_line (start 1.575 1.7) (end 1.7 1.7)
(stroke (width 0.12) (type default)) (layer "F.SilkS") (tstamp ee3d299f-d1ec-4f8b-974f-08fb038e31fc))
(fp_line (start 1.7 -1.7) (end 1.7 -1.575)
(stroke (width 0.12) (type default)) (layer "F.SilkS") (tstamp d85c7a82-8c4d-4116-934b-292ec29f79d5))
(fp_line (start 1.7 1.7) (end 1.7 1.575)
(stroke (width 0.12) (type default)) (layer "F.SilkS") (tstamp 1ca048cb-459b-4bde-a4e8-12fa68560657))
(fp_line (start -2.1 -2.1) (end 2.1 -2.1)
(stroke (width 0.05) (type default)) (layer "F.CrtYd") (tstamp 50d70379-3ac7-40ee-98fc-0ee1340522f0))
(fp_line (start -2.1 2.1) (end -2.1 -2.1)
(stroke (width 0.05) (type default)) (layer "F.CrtYd") (tstamp 9e732196-4689-4e74-b0b4-2087bd6a26ab))
(fp_line (start 2.1 -2.1) (end 2.1 2.1)
(stroke (width 0.05) (type default)) (layer "F.CrtYd") (tstamp 63e0f66b-9dd4-4d50-9e41-88b0141a0feb))
(fp_line (start 2.1 2.1) (end -2.1 2.1)
(stroke (width 0.05) (type default)) (layer "F.CrtYd") (tstamp e59eff8d-d33e-4e49-b735-5df90e33ed35))
(fp_line (start -1.55 -0.55) (end -1.55 1.55)
(stroke (width 0.15) (type default)) (layer "F.Fab") (tstamp afe606f9-29a8-45bc-87d2-54023a8f5ebb))
(fp_line (start -1.55 1.55) (end 1.55 1.55)
(stroke (width 0.15) (type default)) (layer "F.Fab") (tstamp 2a8d5602-b272-4e63-863e-ea6802bd51a0))
(fp_line (start -0.55 -1.55) (end -1.55 -0.55)
(stroke (width 0.15) (type default)) (layer "F.Fab") (tstamp aab1dc3d-576c-4046-8a85-19ec79fc39a6))
(fp_line (start 1.55 -1.55) (end -0.55 -1.55)
(stroke (width 0.15) (type default)) (layer "F.Fab") (tstamp 6773b0ed-b9df-4eaa-8034-ac0434bfdb86))
(fp_line (start 1.55 1.55) (end 1.55 -1.55)
(stroke (width 0.15) (type default)) (layer "F.Fab") (tstamp 253db720-c3a5-4909-bad7-0eefa777a21f))
(pad "1" smd oval (at -1.45 -1.125 90) (size 0.2 0.6) (layers "F.Cu" "F.Paste" "F.Mask")
(thermal_bridge_angle 45) (tstamp 63c783fd-a8bb-4c87-8826-d1d138ffbe64))
(pad "2" smd oval (at -1.45 -0.675 90) (size 0.2 0.6) (layers "F.Cu" "F.Paste" "F.Mask")
(thermal_bridge_angle 45) (tstamp 63c783fd-a8bb-4c87-8826-d1d138ffbe64))
(pad "3" smd oval (at -1.45 -0.225 90) (size 0.2 0.6) (layers "F.Cu" "F.Paste" "F.Mask")
(thermal_bridge_angle 45) (tstamp 63c783fd-a8bb-4c87-8826-d1d138ffbe64))
(pad "4" smd oval (at -1.45 0.225 90) (size 0.2 0.6) (layers "F.Cu" "F.Paste" "F.Mask")
(thermal_bridge_angle 45) (tstamp 63c783fd-a8bb-4c87-8826-d1d138ffbe64))
(pad "5" smd oval (at -1.45 0.675 90) (size 0.2 0.6) (layers "F.Cu" "F.Paste" "F.Mask")
(thermal_bridge_angle 45) (tstamp 63c783fd-a8bb-4c87-8826-d1d138ffbe64))
(pad "6" smd oval (at -1.45 1.125 90) (size 0.2 0.6) (layers "F.Cu" "F.Paste" "F.Mask")
(thermal_bridge_angle 45) (tstamp 63c783fd-a8bb-4c87-8826-d1d138ffbe64))
(pad "7" smd oval (at 1.45 1.125 90) (size 0.2 0.6) (layers "F.Cu" "F.Paste" "F.Mask")
(thermal_bridge_angle 45) (tstamp 63c783fd-a8bb-4c87-8826-d1d138ffbe64))
(pad "8" smd oval (at 1.45 0.675 90) (size 0.2 0.6) (layers "F.Cu" "F.Paste" "F.Mask")
(thermal_bridge_angle 45) (tstamp 63c783fd-a8bb-4c87-8826-d1d138ffbe64))
(pad "9" smd oval (at 1.45 0.225 90) (size 0.2 0.6) (layers "F.Cu" "F.Paste" "F.Mask")
(thermal_bridge_angle 45) (tstamp 63c783fd-a8bb-4c87-8826-d1d138ffbe64))
(pad "10" smd oval (at 1.45 -0.225 90) (size 0.2 0.6) (layers "F.Cu" "F.Paste" "F.Mask")
(thermal_bridge_angle 45) (tstamp 63c783fd-a8bb-4c87-8826-d1d138ffbe64))
(pad "11" smd oval (at 1.45 -0.675 90) (size 0.2 0.6) (layers "F.Cu" "F.Paste" "F.Mask")
(thermal_bridge_angle 45) (tstamp 63c783fd-a8bb-4c87-8826-d1d138ffbe64))
(pad "12" smd oval (at 1.45 -1.125 90) (size 0.2 0.6) (layers "F.Cu" "F.Paste" "F.Mask")
(thermal_bridge_angle 45) (tstamp 63c783fd-a8bb-4c87-8826-d1d138ffbe64))
(pad "13" thru_hole circle (at 0 -0.5) (size 0.6 0.6) (drill 0.2) (layers "*.Cu" "*.Mask") (tstamp cd39d95a-9394-4018-a861-6ad4f6538063))
(pad "13" smd rect (at 0 -0.5) (size 1.21 1) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin -0.1) (thermal_bridge_angle 45) (tstamp 2ae96279-5a7b-457f-945f-a4cee7bbb092))
(pad "13" thru_hole circle (at 0 0.5) (size 0.6 0.6) (drill 0.2) (layers "*.Cu" "*.Mask") (tstamp bb49fea4-4d22-4908-8405-90e1e05cb844))
(pad "13" smd rect (at 0 0.5) (size 1.21 1) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_paste_margin -0.1) (thermal_bridge_angle 45) (tstamp 2ae96279-5a7b-457f-945f-a4cee7bbb092))
)