tangara-hw/tangara-mainboard/footprints.pretty/CUI_SJ-3506-SMT.kicad_mod

(footprint "CUI_SJ-3506-SMT" (version 20221018) (generator pcbnew)
  (layer "F.Cu")
  (attr through_hole)
  (fp_text reference "REF**" (at -2.42555 -8.13681) (layer "F.SilkS")
      (effects (font (size 1.00022 1.00022) (thickness 0.15)))
    (tstamp c1218c7b-1d7a-4d90-a14f-c2045d55583f)
  )
  (fp_text value "CUI_SJ-3506-SMT" (at 4.181225 7.626315) (layer "F.Fab")
      (effects (font (size 1.001488 1.001488) (thickness 0.15)))
    (tstamp af1c7b04-4edc-41ad-bb18-e28db428f41a)
  )
  (fp_text user "PCB EDGE" (at -6.1056 -6.80624) (layer "F.Fab")
      (effects (font (size 0.480441 0.480441) (thickness 0.15)))
    (tstamp c1bed429-7099-429d-8109-6753c9b13f53)
  )
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  (fp_circle (center -4.25 -7) (end -4.15 -7)
    (stroke (width 0.2) (type solid)) (fill none) (layer "F.SilkS") (tstamp f684ea0d-3b5d-4223-880d-b2b0dd022373))
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    (stroke (width 0.01) (type default)) (layer "Edge.Cuts") (tstamp c06517f8-1e0f-4790-84b4-fb9f25280906))
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  (fp_line (start -6.35 -6.75) (end -6.35 -3.25)
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  (pad "1" thru_hole oval (at -4.25 -5.9) (size 1.6 1.1) (drill oval 1.2 0.7) (layers "*.Cu" "*.Mask")
    (solder_mask_margin 0.102) (tstamp ec4d5fc7-f710-44d9-8264-01ebba60ad03))
  (pad "2" thru_hole oval (at 3.6 -5.9) (size 1.8 1.1) (drill oval 1.2 0.7 (offset -0.15 0)) (layers "*.Cu" "*.Mask")
    (solder_mask_margin 0.102) (tstamp 888868bf-423c-4cce-8dff-06a7e5ec73b1))
  (pad "3" thru_hole oval (at 5.4 5.9) (size 1.6 1.1) (drill oval 1.2 0.7) (layers "*.Cu" "*.Mask")
    (solder_mask_margin 0.102) (tstamp 04467c23-d785-4b48-a8df-8c7a45dc233c))
  (pad "4" thru_hole oval (at 2.9 5.9) (size 1.6 1.1) (drill oval 1.2 0.7) (layers "*.Cu" "*.Mask")
    (solder_mask_margin 0.102) (tstamp 5bfa7040-f089-470c-adc2-706697312dcb))
  (pad "5" thru_hole oval (at -4.25 5.9) (size 1.6 1.1) (drill oval 1.2 0.7) (layers "*.Cu" "*.Mask")
    (solder_mask_margin 0.102) (tstamp 16648ace-324b-438c-8ba2-117831fbf9e9))
  (pad "6" thru_hole oval (at 5.4 -5.9) (size 1.8 1.1) (drill oval 1.2 0.7 (offset 0.15 0)) (layers "*.Cu" "*.Mask")
    (solder_mask_margin 0.102) (tstamp 5753d919-209f-4364-bf56-c4cb571eaa4b))
  (pad "SH1" thru_hole oval (at -0.22 -5.9) (size 1.6 1.1) (drill oval 1.2 0.7) (layers "*.Cu" "*.Mask")
    (solder_mask_margin 0.102) (tstamp 568c529d-6e46-4625-b95c-a4230f92006c))
  (pad "SH2" thru_hole oval (at -0.22 5.9) (size 1.6 1.1) (drill oval 1.2 0.7) (layers "*.Cu" "*.Mask")
    (solder_mask_margin 0.102) (tstamp 1bd5e7c4-db32-4875-945e-b5af71e0c640))
)